热管技术目前已经被广泛应用于宇航、军工、石油、化工、冶金、机械、电力、电子、煤炭、铁路、通讯、纺织、家电、IT产品等诸多领域。传统的机房排热设备（空调、新风、热管、乙二醇等）都有一个特点，就是先将机房空间冷却，然后通过机房适宜的空气温度为机房设备降温，这种间接的方式我们将其统称为区域供冷。
Heat pipe technology has been widely used in aerospace, military industry, petroleum, chemical industry, metallurgy, machinery, electric power, electronics, coal, railway, communication, textile, home appliances, IT products, and many other fields. Traditional engine heat removal equipment, air conditioning, fresh air, heat pipe, ethylene glycol, etc.) has a characteristic, is the first room space cooling, and then through the room appropriate air temperature to cool the engine room equipment, this kind of indirect way we will be referred to as district cooling.
全新的方式是直接吸收设备排出的热量，使机房设备排放的热量降到最低，机房温度将不会因为机房设备的大量排热而升高，将大幅度解决机房现存的诸多问题：
New way is the direct discharge of heat absorption equipment, make the room equipment to minimize the emission quantity of heat, room temperature will not be because of a large amount of heat removal of power supply, rise, will greatly solve the machine room of existing many problems:
1：正温差大，易于换热，同时其能耗也将轻易降低。
所有的导热、换热设备均有一个共性，即吸热点与排热点温差越大，导热、换热的效率越高，机房设备是整个机房的热源所在，设备出风温度往往高于50℃甚至更高，设备内的部分芯片温度甚至可达100℃以上。这种温差下，消除高温热点可以比降低空间温度更容易、效率更高、投入更低。
All of the thermal conductivity and heat exchange equipment all have a common, namely hot absorption and row hot temperature difference, the greater the thermal conductivity, the higher the efficiency of the heat transfer, computer room equipment is the heat of the engine room, outlet air temperature tends to equipment above 50 ℃ or higher, equipment inside part of the chip temperature even can reach above 100 ℃. This temperature difference, eliminate the high temperature hot spots can be much easier and more efficient than the lower space temperature and lower investment.
2：机房设备循环出风温度更接近机房设备循环进风温度，对气流要求小，可大幅度裁减机房风量和风压。试想，如果机房设备的工作排热在最初阶段（未能影响周边温度环境之前）就已被传导到了室外，排出的空气温度也接近设备需求温度的话，那么大风量高风压对机房来说，便失去了主要存在的意义。
Circulating wind temperature closer to the computer room equipment room equipment cycle into the wind temperature, small to air flow requirement, can sharply cut machine room air volume and air pressure. , imagine if work of power supply, heat removal in the initial stage (before failed to affect the temperature of the surrounding environment) has been conducted in the outdoor, discharge air temperature was close to equipment needs, so big air volume high wind pressure for machine room, lost the main meaning of existence.
3：降温设备不占用机房面积。
为了满足降低机房空间温度的要求，机房区域供冷设备必须将其所需的各类部件用合理的方式集成在一起，才能成为空调，由于机房专用空调的特殊目的，目前最精巧的设计也只能做到包括维护工位每平米占地（室内）20KW显冷量的目标。而使用逐点换热的方式由于不需要风机，同时每一个换热终端都可以非常小巧，可以集成到机柜角落、顶端、柜门夹缝、设备内部等位置，连接管线可以在机柜顶部和底部的线架上敷设。实际使用中，不需要单独为换热设备单独预留使用面积，也不需要为连接管线特意预留过多的机房空间。
In order to meet the requirements of lower the temperature in the room space, district cooling equipments have to be required for all kinds of components in a reasonable way to integrate, to become a air conditioning, due to the special purpose equipment room dedicated air conditioning, by far the most sophisticated design also can only do include maintenance station 20 kw per square meter covering (indoor) show the target of cold quantity. And using point by point by means of heat transfer due to the need to fan, while each heat transfer terminal can be very small and can be integrated into the top of the cabinet corner,, cupboard door position such as cracks, equipment internal, connection can rack installation in the cabinet at the top and bottom of the line. In practical use, do not need to separate individual reserved for heat exchange equipment using area, also do not need too much room reserved space specially for connection.
4：现有的技术水平可以轻易的满足设备机柜达到极高的吸热量，更可轻易扩容。
Existing technology can easily accommodate equipment cabinet to achieve very high heat absorption, more can be easily expanded.
5：机房设备扩容不受空间环境限制。
在高热芯片上安装热管吸热终端，将设备所有高热芯片的吸热终端并联后接口预留到设备外部，与机柜内预留的气、液管道连接并联到室外换热器，可以直接让高热芯片与机房外界的空气换热。由于热管的特性，吸热端可以将散热接触面的温度更接近管内液体的沸点（本数据可达到室外散热处的环境温度），因而在现有条件下，可以让机房设备的芯片工作温度大大低于之前芯片的工作温度，进一步提高机房设备的可靠性。同时，因为减少了设备的排温部件、降低了设备的故障点、减少了设备的能耗、更容易使用性能更强劲的芯片，所以我们预计，设备提供方也是非常愿意做出这种配合的。
On hot chip installed heat pipe heat absorption end, after all hot chip endothermic terminal equipment into parallel interface reserved to external equipment, with the cabinet reserved gas, liquid pipe connected in parallel to the outdoor heat exchanger, can directly make hot chips and room air heat transfer from the outside. Due to the characteristics of heat pipe heat absorption end can heat the temperature of the contact surface is more close to the boiling point of the liquid inside, the data can be achieve cooling of outdoor environment temperature), therefore, under the existing conditions can let the machine room equipment operating temperature is much lower than before the chip work temperature, further improve the reliability of computer equipment. At the same time, for reducing the exhaust temperature equipment parts, reduce the equipment failure point, reduce the energy consumption of equipment, easier to use a stronger performance chip, so we expected, equipment providers is also very willing to make that match.
